Technical issues for lead-free products include:
| o |
Development of lead-free material while maintaining substrate mounting technology |
| o |
Improvement of heat-resistance for IC packages |
| o |
Customers must ensure that the re-flow profile is compatible with remainder of components on their Printed Circuit Board (PCB) |
Terminal Composition
| Package type |
Current |
Lead-Free |
| Surface-mount type |
Sn-Pb plating |
Sn-Bi plating |
| Sn-Pb ball |
Sn-Ag-Cu ball |
| Through-hole type |
Sn-Pb plating |
Sn-Bi plating |
Mounting Conditions for Lead-Free Products
| � |
In general, mounting with lead-free soldering paste requires increased re-flow temperature.
Current heat resistance of a surface-mount package is designed to resist a maximum re-flow peak temperature of 260�C. However, package templates can vary by product. Please review re-flow profiles for each product |
OKI Technical Paper (in pdf format)
More on OKI's Lead-free Packages
OKI Semiconductor will continue to provide conventional lead-style product manufacturing and availability.
| � |
OKI will continue to follow EOL procedures for those products that will be discontinued. |
A package code designation will be used to identify lead-free products from current products.
| � |
Care of correct ordering part number should be taken for Purchase Order Placement and review. |
