Classification by the Mounting Method
1) Through-hole mount
packages (129 KB)
Through-hole packages have a
structure in which the lead pins are inserted and soldered into holes (0.8 to
1.0 mm in diameter) drilled through the printed circuit (PC) board, and find
wide applications in electronic equipment where board space is not at a premimum
or where costs are a constraint.
DIPs, and PGAs are typical
packages in this group. ZIPs, skinny DIPs, and shrink DIPs are high-pin-density
IC packages which can be used in these applications.
2) Surface mount
packages (194 KB)
Surface mount packages have a
flat structure in which the lead pins are soldered directly to the soldered
pattern (called the mount pad) provided on the PC board, and are used in
high-pin-density IC package situations because devices can be mounted on both
sides of the PC board. QFPs and QFJs (PLCC) are typical packages in this group.
3) Custom
packages (194 KB)
Memory modules are packages
which have several memory ICs mounted on a PC board, Tape carrier packages (TCP)
using Tape Automated Bonding (TAB) techniques, Chip On Board (COB) packages, or
IC card packages. TCP and COB packages are custom designs conforming to the
customer's specifications.
Classification by the Package Materials
Packages
are broadly classified into ceramic and plastic packages. Package materials can
be selected according to their application or operating environment.
Ceramic packages are known for their high reliability, but plastic packages
are becoming more popular due to their low cost (when compared to ceramic
packages). Reliability has improved considerably in the last few years making
plastic a very attractive alternative to ceramic.
