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Q1.
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What support for Hot Swap (PICMG 2.1) is included on the chip? The hot swap question is really about the output device structure. If the outputs have a clamp diode to VCC, the CTx12 device could sustain damage or damage connected active components during a hot insertion. A clamp diode is inherent in P-channel FETs frequently used in 3.3Volts components to pull the output voltage to the VCC rail. They are also added for ESD protection. Are these clamp diodes present in the CTx12 devices?
See Application Note for Hot-Swap
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